Polymer-based materials for flexible electronics applications
Date19th Jan 2022
Time04:00 PM
Venue Google meet
PAST EVENT
Details
Encapsulation is integral to electronic devices to maintain long-term functionality and stability. While a variety of materials and solutions are available for conventional silicon-based electronics, not all of them are suitable for flexible optoelectronic devices. Typically, these devices require materials with low processing temperature, while maintaining both the optical and electrical functionalities. Simple deposition and low cost are added advantages. In this work, we show that pure polydimethylsiloxane (PDMS), PDMS–zinc oxide (ZnO) and PDMS – titanium dioxide (TiO2) nanocomposites are suitable encapsulants for flexible electronics. These coatings are electrically and thermally insulating, optically transparent, hydrophobic, and offer good environmental protection under wearable conditions. The coatings can be prepared by a simple spin coating process and annealed at temperatures less than 150 ℃. The performance of pure PDMS and PDMS-ZnO and PDMS-TiO2 were evaluated using different characterisation techniques. These coatings were tested on both printed nanowire patterns and commercial flexible RFID tags. The addition of up to 2 wt. % ZnO was found to improve the properties of PDMS, improving the environmental protection, without significantly affecting the optical transparency. Silver nanowire (Ag NW)-PDMS strain flexible strain sensors are also being explored in this work. To this end, as a first step, a conductive and printable ink of Ag NWs is being developed. It is observed that these nanowires exhibit good conductivity.
Speakers
Garikapati Nagasarvari
Metallurgical and Materials Engineering