A method is presented to evaluate the interfacial bond weakness of aluminium-based honeycomb sandwich structure using Shear Horizontal (SH) guided wave. SH guided waves are sensitive to the interfacial properties since the wave particles vibration is oriented parallel to the adhesive-adherent joints. The boundary stiffness approach is used to model the adhesive-adherent interface, wherein the adhesion between the adhesive and adherend is modelled using the distribution of springs. Various levels of adhesion are modelled by varying the spring stiffness. The sensitivity of SH guided wave mode to varying the transverse spring stiffness (Kt), epoxy shear modulus (eC44), epoxy adhesive thickness, honeycomb core gap, and core thickness in an aluminium-based honeycomb sandwich structure is investigated. The time-of-flight method identifies the bond adhesive properties in the honeycomb sample. The frequency-wavenumber analysis reveals that multiple modes SH0 and reverberated SH0 are present in the case of a perfect bond. The reverberated SH0 mode is generated due to interaction between the SH0 and the hexagonal honeycomb core. The multiple modes are present only as a specific limit of (tangential spring stiffness), thereafter only SH0 mode is present. Thus, the presence or absence of the reverberated SH0 mode is used as an indicator for bond quality. Periodic permanent magnet (PPM) electromagnetic acoustic transducers (EMATs) generate the input signal for the experimental validation., An in-plane differential laser vibrometry setup was used to detect SH modes on a honeycomb sandwich structure with programmed skin-honeycomb interfacial defects. The analysis shows a reliable non-destructive evaluation technique for classifying the bond with different interfacial conditions bonds.