{Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling}

Title{Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling}
Publication TypeJournal Article
Year of PublicationSubmitted
AuthorsVerma, P., CD, Nagarajan, T
JournalProc. I.MechE, Part C: J Mechanical Engineering Science
Volume223
Pagination953–963