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Sekhar MS, Ramanathan S. {Characterization of copper chemical mechanical polishing (CMP) in nitric acid-hydrazine based slurry for microelectronic fabrication}. {THIN SOLID FILMS}. {504}:{227-230}.
Prasad NY, Kumar VV, Ramanathan S. {Electrochemical impedance spectroscopic studies of copper dissolution in arginine-hydrogen peroxide solutions}. {JOURNAL OF SOLID STATE ELECTROCHEMISTRY}. {13}:{1351-1359}.