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Prasad NY, Ramanathan S. {Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor}. {ELECTROCHIMICA ACTA}. {52}:{6353-6358}.
Venkatesh PR, Ramanathan S. {Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide-hydrogen peroxide based slurries}. {JOURNAL OF APPLIED ELECTROCHEMISTRY}. {40}:{767-776}.