Publications
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. {Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor}. {ELECTROCHIMICA ACTA}. {52}:{6353-6358}.
. {Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide-hydrogen peroxide based slurries}. {JOURNAL OF APPLIED ELECTROCHEMISTRY}. {40}:{767-776}.
. {Electrochemical impedance spectroscopic studies of copper dissolution in glycine-hydrogen peroxide solutions}. {JOURNAL OF SOLID STATE ELECTROCHEMISTRY}. {14}:{2057-2064}.