Publications
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. Facile synthesis of palladium nanoclusters and their catalytic activity in Sonagashira coupling reactions. Tetrahedron Lett. 2008;49:5286-5288.
. Role of abrasives in high selectivity STI CMP slurries. Microelectron. Engg. 2008;85:1748-1753.
. Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor. Electrochimica Acta. 2007;52:6353-6358.
. {An analysis of drifts and nonlinearities in electrochemical impedance spectra}. {ELECTROCHIMICA ACTA}. {56}:{7467-7475}.
. {Characterization of copper chemical mechanical polishing (CMP) in nitric acid-hydrazine based slurry for microelectronic fabrication}. {THIN SOLID FILMS}. {504}:{227-230}.
. {Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor}. {ELECTROCHIMICA ACTA}. {52}:{6353-6358}.
. {The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasives}. {APPLIED SURFACE SCIENCE}. {255}:{3764-3768}.
. {Effect of potential drifts and ac amplitude on the electrochemical impedance spectra}. {ELECTROCHIMICA ACTA}. {56}:{2606-2615}.
. {Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide-hydrogen peroxide based slurries}. {JOURNAL OF APPLIED ELECTROCHEMISTRY}. {40}:{767-776}.
. {Electrochemical impedance spectroscopic studies of copper dissolution in glycine-hydrogen peroxide solutions}. {JOURNAL OF SOLID STATE ELECTROCHEMISTRY}. {14}:{2057-2064}.
. {Electrochemical impedance spectroscopic studies of copper dissolution in arginine-hydrogen peroxide solutions}. {JOURNAL OF SOLID STATE ELECTROCHEMISTRY}. {13}:{1351-1359}.
. {Experimental and theoretical investigation on microwave melting of metals}. {JOURNAL OF MATERIALS PROCESSING TECHNOLOGY}. {211}:{482-487}.
. {Facile synthesis of palladium nanoclusters and their catalytic activity in Sonogashira coupling reactions}. {TETRAHEDRON LETTERS}. {49}:{5286-5288}.
. {Identification of reaction mechanism for anodic dissolution of metals using Electrochemical Impedance Spectroscopy}. {JOURNAL OF ELECTROANALYTICAL CHEMISTRY}. {638}:{183-188}.
. {Mechanism of high selectivity in ceria based shallow trench isolation chemical mechanical polishing slurries}. {THIN SOLID FILMS}. {518}:{5737-5740}.
. {Potassium Bromate as an Oxidizing Agent in a Titania-Based Ru CMP Slurry}. {ELECTROCHEMICAL AND SOLID STATE LETTERS}. {13}:{H385-H387}.
. {Role of abrasives in high selectivity STI CMP slurries}. {MICROELECTRONIC ENGINEERING}. {85}:{1748-1753}.
. {Role of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP}. {ELECTROCHEMICAL AND SOLID STATE LETTERS}. {9}:{G337-G339}.
