Publications
Export 4 results:
Sort by: Author Keyword Title Type [ Year
] Filters: Author is Y. Nagendra Prasad [Clear All Filters]
. Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor. Electrochimica Acta. 2007;52:6353-6358.
. {Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor}. {ELECTROCHIMICA ACTA}. {52}:{6353-6358}.
. {Electrochemical impedance spectroscopic studies of copper dissolution in arginine-hydrogen peroxide solutions}. {JOURNAL OF SOLID STATE ELECTROCHEMISTRY}. {13}:{1351-1359}.
. {Role of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP}. {ELECTROCHEMICAL AND SOLID STATE LETTERS}. {9}:{G337-G339}.