Course Name: EE5550 : Microelectromechanical Systems

Description: 1. Silicon as a material for microelectromechanical structures and devices : Mechanics and modeling of membranes, beams, comb drive and resonators. The effects of miniaturization and scaling. 2. Silicon micromachining : Photolithography,thin film deposition and doping, wet chemical etching, plasma etchingand RIE, wafer bonding, surface micromachining and stiction, LIGA and DRIE for high aspect ratio. 3. Sensing and actuating mechanisms : piezoresistive, piezoelectric, capacitive and tunneling effects. 4. Microsensors : Pressure sensors, acceleration and angular rate sensors, flow sensors based on piezoresistive, piezoelectric and electrostatic (capacitive) effects using bulk and surface micromachining approaches. Resonant sensors. 5. Microactuators and their applications: Micropumps, valves, miniature microphones and micromotors. Their design and fabrication usiong bulk and surface micromachining. RF switches and RF MEMS. 6. Microfluidics and microreactors. 7. Integration of electronics with micromachin

Slot: F

RoomNo: ESB207B

Instructor: Enakshi Bhattacharya

Period: JAN-MAY 2013

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