Course Name: CH5400 : Microelectronic Fabrication

Description: Review of Chip Manufacturing Process, FEOL and BEOL concepts BEOL: Interconnect formation, importance of BEOL for delay and yield, Process Integration Lithography: Layout, mask, photo, basic steps in litho, stepper vs. scanner, Depth of Focus, RET, OPC, PSM partial field chips Deposition: PVD & CVD concepts, Electrochemical depositions, Electromigration vs grain size, Atomic Layer Deposition Material Removal: Wet and Dry etching, Aluminum and Oxide etching, Chemical Mechanical Planarization, Dishing, Erosion, Issues in Shallow Trench Isolation FEOL: Review of electron band structure, MOSFET operation, FEOL integration 28 Diffusion and Ion Implementation: Interstitial and Substituional diffusion, Constant Source and Limited Source Diffusion, Dopant redistribution, lateral diffusion, Ion implantation mechanism, Channeling, RTA Testing and Yield: Parametric (Scribeline) and product testing, Analysis of sort (bin) test, Parametric test structures, Memory Tests, Memory Repair, IDDQ, QBD, Reliability, Defectivity,

Slot: E

RoomNo: MSB235

Instructor: Ramanathan S

Period: JAN-MAY 2013

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